1、 Core preparation process: Powder metallurgy method

1. Raw material preparation

Using high-purity tungsten powder and electrolytic copper powder, mixed in a standard ratio of Cu=30:70, the tungsten content can be adjusted within the range of 50% -90% to meet different working conditions.

Add wax based formula binder to enhance the strength and rheological properties of the green body.

2. Compression molding

By using static pressure forming or plastic extrusion technology to prepare tubular green bodies, the density of the green bodies is strictly controlled to ensure the final density.

3. Sintering and infiltration

Staged sintering:

Hydrogen pre sintering: Remove binder at 600-900 ℃

Vacuum final sintering: Increase the density to 96% -99% at 1100-1380 ℃.

Copper melt infiltration: Molten copper infiltrates the pores of tungsten skeleton to achieve densification, and can produce precision pipes with inner diameters of 0.1-10mm.

2、 Plastic processing strengthening technology

1. Hot forging and warm rolling

Rotary forging is carried out in a hydrogen environment at 1200-1500 ℃ to gradually deform the alloy, significantly improving its tensile strength and hardness.

The hot rolling temperature is 1350-1500 ℃, and the plate is thinned to 0.2mm by combining with warm rolling. During the process, graphite lubrication is sprayed to prevent cracking.

2. Precision drawing

Adopting the "warm drawing" process, preheated to 100-350 ℃ and gradually drawn by a chain stretching machine, suitable for fine pipes.

3、 Comparison of other processing methods

Powder metallurgy+infiltration: high-precision thin-walled tube, complex process, long production cycle;

Rotary forging: High strength thick walled tube, high equipment cost, only suitable for converting bar blank to round tube;

Casting method: Mass production of simple structural pipe fittings, low precision, and prone to internal defects;

Additive manufacturing: complex irregular structures, extremely high costs, and insufficient material density.

4、 Key Performance Control

Conductivity and thermal conductivity: Control the copper content to ensure conductivity and arc breaking performance.

Thermal compatibility: Matching the thermal expansion coefficient with the semiconductor substrate through component design.

Surface processing: The turning process can achieve a surface roughness Ra ≤ 1.6 μ m for pipes with an inner diameter of ≥ 0.5mm.